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Xi‘an Electronic Technology University employing BGA machine case

Time:2021-08-31 Views:327
Xi‘an Electronic Technology University is abbreviated as "Xidian" or "Xijundian". It is a university under the central government. In 1959,
the central government identified the first batch of 20 national key universities directly under the Ministry of Education. Jointly built by the
National Defense Science and Technology Industry Bureau and China Electronics Technology Corporation, it ranks among the national
"Double First Class", "211 Project", "985 Project Advantage Discipline Innovation Platform" (Characteristic 985 Project), and "2011 Plan"
key construction ranks. One of the first two key military academies for national defense industry (Kazakhstan Military Industry and Western
Military Electronics) and one of the 56 graduate schools approved by the Ministry of Education, members of the "Two Telecommunications
and One Post", successively selected into the first batch of two countries Cyberspace security talent training base, the first batch of 5 national
integrated circuit talent training bases allocated special funds by the Ministry of Science and Technology, the first batch of 7 world-class cyber
security colleges (ranked first), the first batch of 9 national demonstrative microelectronics colleges ( Chairman Unit), the first batch of 11 standing
council units of the China Artificial Intelligence Education Joint Association, and the first batch of 35 national exemplary software colleges.

BGA packages benefit from their small size and large storage space, and are widely used in various technological products and fields. It has become
the most indispensable part of people‘s daily life, and various universities have also launched professional courses related to BGA packaging, and have
trained a group of scientific and technological talents in the field of science and technology.

However, due to its small size, the BGA packaging method has very high requirements for solder joints. If the solder joints have problems such as empty
soldering, virtual soldering, etc., it will directly cause the BGA package to fail. How to improve the reliability of BGA solder joints requires reliable BGA rework
station equipment. In order to enable students to better learn the principles and techniques of BGA packaging, Xidian University combines theory with practice.
Specially introduced Dinghua BGA rework station as teaching equipment to provide students with professional teaching courses, so that these future scientific
and technological talents can master more comprehensive BGA packaging knowledge.
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