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Advanced Electronics Assembly on a Miniature Scale
Beyond BGAs, another common miniaturization technique is the use of wafer level chip scale packages.
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Doing More with Less: Downsizing with Ball Grid Arrays
A ball grid array package showing the protected top and exposed underside gridded with solder balls. A grid pattern of solder balls is used where each ball becomes a connection between the circuit board and the BGA package. In this way, attaching a BGA on a printed circuit board reduces the overall system size...
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Making Miniaturization Possible with Advanced Electronics Assembly
The first mobile phones were literally the size of bricks and all they could do was make phone calls. Now think about the thin, lightweight mobile device that fits easily in your pocket today. In addition to making calls, it‘s a camera, a calculator and a calendar. It has email and text messaging. It‘s a calenda...
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The components of the printed circuit board are smaller and lighter and thinner
For the smaller and thinner chips, How can we do?
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