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Temperature profile set methods for a BGA rework station
You need to know the theory by which you can set a better temperature profile for your BGA rework station if you are new to use BGA rework machine.
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PCB Layout of Chips On Board
The substrate is used as a carrier for silicon. The two main reasons are to avoid CTE mismatch and to protect integrated circuits from environmental impacts.
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How is the Chip-on-Board Process?
Chip on board (CoB) is simply a specialized process for connecting integrated circuit chips to any given substrate or board.
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Xray counting machine application
Which can help you save time and improve working efficiency when counting countless components.
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The use of xray detection in the field of automobile and aerospace
X-ray inspection has a wide range of applications in the automotive and aerospace fields, mainly in the following aspects
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Advanced Electronics Assembly on a Miniature Scale
Beyond BGAs, another common miniaturization technique is the use of wafer level chip scale packages.
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Doing More with Less: Downsizing with Ball Grid Arrays
A ball grid array package showing the protected top and exposed underside gridded with solder balls. A grid pattern of solder balls is used where each ball becomes a connection between the circuit board and the BGA package. In this way, attaching a BGA on a printed circuit board reduces the overall system size...
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Making Miniaturization Possible with Advanced Electronics Assembly
The first mobile phones were literally the size of bricks and all they could do was make phone calls. Now think about the thin, lightweight mobile device that fits easily in your pocket today. In addition to making calls, it‘s a camera, a calculator and a calendar. It has email and text messaging. It‘s a calenda...
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The components of the printed circuit board are smaller and lighter and thinner
For the smaller and thinner chips, How can we do?
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