2025 Nepcon China in Shanghai

Focus on surface mount semiconductor packaging and testing. There will also be "PCBA + semiconductor packaging and testing + smart factory"
waiting for us to participate in this feast of future wisdom.

 

In addition, NEPCON China 2025 also cooperated with Embalaje IC Feria Semiconductor Packaging Technology Exhibition to innovatively establish
packaging and testing process demonstration lines for different device types. It provides customized displays based on the packaging process needs
of three products: integrated circuits, optical modules and power modules to help companies explore new opportunities.

On site, through diversified forms such as "conferences+competitions+innovation exhibitions+special matching", we discussed new standards,
technologies, and applications with industry elites in the fields of electronic manufacturing, semiconductors, automobiles, new energy, the Internet of Things,
artificial intelligence, etc., and witnessed and promoted the prosperity and development of the electronic manufacturing industry together.

Address: Shanghai World Expo Exhibition&Convention Center