| Power supply | 100~220V +/-10% |
| Rated power | 6800W |
| Upper power | 1200W |
| Lower power | 1200W |
| IR power | 4200W |
| Operation mode | fully automatically desodoldering, pick-up, mounting and soldeirng |
| Main configuration | Auto feeding and recycling system, HD touchscreen for temperature profile setting and analysis and optical alignment system |
| Temperature profile storage | more than 50000 groups |
OPtical CCD |
With chio-feeder, automatically run for feeding or recycling, and aligning. |
PCB position |
Up and down intelligent positioning, bottom "5-point support" with V-groove fixed PCB which can be adjusted freely in the X-axis direction, with universal fixtures meanwhile |
BGA position |
Laser point dedicated to find the center of chip so that chip and PCB put quickly |
Chip |
1*1~70*70mm |
Chip spacing |
0.15mm |
Dimension |
L970*W850*H950 mm |
Weight |
120kg |
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+8615768114827 +86-755-29091822 |
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4th Floor, Building 6B, Shengzuozhi Technology park, Xinqiao(518125), Bao‘an, Shenzhen, Guangdong, the People‘s Republic of China |
Email
John- VK App,too
Skype
+86 157 6811 4827+8613923792185Roger
