Shenyang Institute of Automation Chinese Academy of Sciences employing BGA machine case
Time:2018-10-16
Views:1701
The Shenyang Institute of Automation Chinese Academy of Sciences was established in November 1958. At the beginning of its establishment,
it was called the Liaoning Institute of Electronic Technology. In April 1960, it was renamed the Institute of Automation of the Liaoning Branch of
the Chinese Academy of Sciences. From 1962 to 1972, it was named the Northeast Institute of Industrial Automation, Chinese Academy of Sci-
ences. From 1972, it was officially named the Chinese Academy of Sciences. Shenyang Institute of Automation.
it was called the Liaoning Institute of Electronic Technology. In April 1960, it was renamed the Institute of Automation of the Liaoning Branch of
the Chinese Academy of Sciences. From 1962 to 1972, it was named the Northeast Institute of Industrial Automation, Chinese Academy of Sci-
ences. From 1972, it was officially named the Chinese Academy of Sciences. Shenyang Institute of Automation.
With the rapid development of science and technology today, all aspects of people’s lives are getting better and better. Because of the continuo-
us development of science and technology, the application of various science and technology and the availability of science and technology pro-
ducts have brought people a variety of conveniences and solved the problem. Many of the original troubles in life make life more and more happ-
ier. But all these technological developments and the popularization of technological products, in addition to the continuous exploration and inno-
vation of scientists, the continuous upgrading and application of chip packaging, also play a vital role.
us development of science and technology, the application of various science and technology and the availability of science and technology pro-
ducts have brought people a variety of conveniences and solved the problem. Many of the original troubles in life make life more and more happ-
ier. But all these technological developments and the popularization of technological products, in addition to the continuous exploration and inno-
vation of scientists, the continuous upgrading and application of chip packaging, also play a vital role.
Due to its small size, the BGA chip packaging method has very high requirements for solder joints during application. If the solder joints have pro-
blems such as empty soldering or virtual soldering, it will directly cause the BGA package to fail. How to improve the reliability of BGA solder joints
requires reliable BGA rework station equipment.
blems such as empty soldering or virtual soldering, it will directly cause the BGA package to fail. How to improve the reliability of BGA solder joints
requires reliable BGA rework station equipment.
The Dinghua series BGA rework station produced by Shenzhen Dinghua Technology Development Co., Ltd. has the advantages of precise temp-
erature control, simple operation, and high welding success rate. It is also very popular in the military industry and scientific research units. To he-
lp them solve the problem of chip packaging and welding during the development of new products, it has become a popular and practical device.
erature control, simple operation, and high welding success rate. It is also very popular in the military industry and scientific research units. To he-
lp them solve the problem of chip packaging and welding during the development of new products, it has become a popular and practical device.
Shenyang Automation Research Institute, after comparing various indicators of many BGA rework equipment at home and abroad, finally determ-
ined that the Dinghua series of BGA rework stations are superior in quality, performance and rework success rate, and reached a cooperation with
Dinghua in 2017 Agreement to purchase Dinghua BGA rework station for the soldering and disassembly of chip packaging during the research and
development of new projects of Shenyang Automation Research Institute, contributing to the success of Shenyang Automation Research Institute’s
new product research and development
ined that the Dinghua series of BGA rework stations are superior in quality, performance and rework success rate, and reached a cooperation with
Dinghua in 2017 Agreement to purchase Dinghua BGA rework station for the soldering and disassembly of chip packaging during the research and
development of new projects of Shenyang Automation Research Institute, contributing to the success of Shenyang Automation Research Institute’s
new product research and development
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